FACILITIES AND INFRASTRUCTURE
PISA ELECTRONICA´S production plant has an area of 650 m² and 60 m² of space of offices. In addition, there is 200 m² for storage space for raw materials, ongoing-manufacture and the final product. Our resources allow flexibility for the best result.
- Screen printing machine adhesive or solder paste with DEK 265 GSX Proflow system
- SMT 400 C oven with four heating zones by convection..
- Dispensing Machine FUJI GL V.
- Machine axial component insertion flag UNIVERSAL.
- Pick & Place Machines for surface mounting of electronic components (SMD), brand: FUJI CP IV 3 and CPVI
- Pick & Place Machine for surface mounting of electronic components (SMD), IP II FUJI brand.
- Machines (2 units) Pick & Place for surface mounting of electronic components (SMD) PHILIPS brand CSM 84 III.
- Pick & Place Machine for surface mounting of electronic components (SMD), brand Tescom 501.
- Sequencing machine axial components, UNIVERSAL brand.
- MAGNATHERM Vitronics oven 800, with 8 convection heating zones and two cooling zones.
- Soldering machine with double wave sprayflux, SOLTEC DELTA.
- Line 12-meter motorized equipment for final assembly.
- Checking Equipment “Test in circuit” brand Cheksum, 400 and 600 test points.
- Machining equipment for industrialization series (lathe, milling cutter, etc.)
- Various automatic and manual preformers.