EspañolEnglish

FACILITIES AND INFRASTRUCTURE

PISA ELECTRONICA´S production plant has an area of 650 m² and 60 m² of space of offices. In addition,  there is 200 m² for storage space for raw materials, ongoing-manufacture and the final product. Our resources allow flexibility for the best result. 
 

 

  • Screen printing machine adhesive or solder paste with DEK 265 GSX Proflow system
  • SMT 400 C oven with four heating zones by convection..
  • Dispensing Machine FUJI GL V.
  • Machine axial component insertion flag UNIVERSAL.
  • Pick & Place Machines for surface mounting of electronic components (SMD), brand: FUJI CP IV 3 and CPVI
  • Pick & Place Machine for surface mounting of electronic components (SMD), IP II FUJI brand.
  • Machines (2 units) Pick & Place for surface mounting of electronic components (SMD) PHILIPS brand CSM 84 III.
  • Pick & Place Machine for surface mounting of electronic components (SMD), brand Tescom 501.
  • Sequencing machine axial components, UNIVERSAL brand.
  • MAGNATHERM Vitronics oven 800, with 8 convection heating zones and two cooling zones.
  • Soldering machine with double wave sprayflux, SOLTEC DELTA.
  • Line 12-meter motorized equipment for final assembly.
  • Checking Equipment “Test in circuit” brand Cheksum, 400 and 600 test points.
  • Machining equipment for industrialization series (lathe, milling cutter, etc.)
  • Various automatic and manual preformers.